Wedge Type Pitch Change Head
Key Features
① Heads are manufactured for accurate transfer and placement of packages in semiconductor manufacturing processes.
② Head is a key robot that precisely picks up and transports semiconductor devices and performs precisely pitch transformations.
③ Various types of variable pitch heads such as link type, cam type, wedge type, etc. are designed and manufactured, so each type plays a role suitable for a specific application field and condition.
④ Development of miniaturized, low-vibration, high-efficiency, and lightweight heads to keep up with the latest trends.
⑤ It produces operable heads from a minimum pitch distance of 2mm and supplies the best products that satisfy both precision and performance.
⑥ Pitch tolerance: ±0.05 mm
⑦ Repeated tolerance: ±0.025 mm
⑧ Pitch: 10.0 ~ 20.0 mm (Changeable)
Specifications
| Product Name |
Wedge Type Pitch Change Head |
| Brand Name |
Wedge Head |
| Function |
A device that transfers semiconductor chips through various pitch adjustments by changing the angle and size of the wedge according to semiconductor equipment specifications. |
| Material |
AL+SUS+Special Material |
| Size |
Depends on customer's request specifications. |
| Origin |
Republic of Korea |
About Us
∙ Company Overview
Since its establishment in June 1999, PSMP Co., Ltd. has consistently been a pioneer in technological innovation.
Leveraging outstanding technical expertise in the semiconductor and various automation equipment fields, we are dedicated to researching and developing world-class PICK & PLACE MODULE and specialized-purpose CYLINDER products.
We have stayed attuned to the rapid changes in technology, not missing the trend of miniaturization in semiconductor packaging.
In line with this, we are working even more meticulously, from design to production, assembly, and inspection, under close collaboration with experts, to provide total solutions in the field of ultra-precision, low-vibration HEAD MODULE.
∙ Factory Information
① Own building
② Factory site area: 748.5m2
③ Manufacturing facility area: 490.92m2
∙ Our Service
Design ⇒ production ⇒ assembly ⇒ performance verification ⇒ quality inspection ⇒ delivery --- Total Solution Supply.
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