SSP, DAP-423 Auto Dispensing&Lid Attach System with Cure, Semiconductor packaging equipment, Lid attach machine, Adhesive dispensing system, High precision dispensing ±0.03 mm, BGA packaging automation, fcBGA / LGA assembly equipment, Pick and place lid attach, Automated curing system 220°C, Real-time force monitoring system, High force press control 1000 kgf, Semiconductor strip/boat handling, Nozzle auto cleaning system
- Brand :
- SSP
- Size :
- 8,000(l) × 1,550(W) × 2,000(H)
- MOQ :
-
1 Set
Depend on quantity
SSP
- Business Type
- Manufacturer
- Main Product